Semi Doped/
Datacenter Interconnects: Copper vs. Optics, Nvidia's 78-Layer PCB, Co-Packaged Optics (CPO)
The episode argues that AI datacenters are increasingly limited by interconnects, not compute, and walks through the tradeoffs between copper and optics across scale-up, scale-out, and scale-across networking. It also explains why Nvidia is pushing copper extremely far with a 78-layer PCB and why co-packaged optics remains a promising but hard-to-service “holy grail.”
