Andrew Wagner

Ep. 019 - Inside the STEEL Lab: From Package to Transistor (Teardown Lab) | Afzal Ahmad, Andrew Wagner, Jordan Nanos

SemiAnalysis’s STEEL team explains how it tears down chips from package to transistor to infer process, architecture, and packaging details. The episode centers on SMIC’s N3 node and Huawei’s Kirin 9030, highlighting aggressive DUV scaling, SRAM shrink, NPU changes, and the growing challenge of analyzing backside power, gate-all-around, and advanced packaging.