Topic

Advanced Packaging

Artwork for Ep. 019 - Inside the STEEL Lab: From Package to Transistor (Teardown Lab) | Afzal Ahmad, Andrew Wagner, Jordan Nanos
SemiAnalysis WeeklyAfzal Ahmad, Andrew Wagner

Ep. 019 - Inside the STEEL Lab: From Package to Transistor (Teardown Lab) | Afzal Ahmad, Andrew Wagner, Jordan Nanos

SemiAnalysis’s STEEL team explains how it tears down chips from package to transistor to infer process, architecture, and packaging details. The episode centers on SMIC’s N3 node and Huawei’s Kirin 9030, highlighting aggressive DUV scaling, SRAM shrink, NPU changes, and the growing challenge of analyzing backside power, gate-all-around, and advanced packaging.

Artwork for Re-engineering the Semiconductor Supply Chain with Intel CEO Lip-Bu Tan
No PriorsLip-Bu Tan

Re-engineering the Semiconductor Supply Chain with Intel CEO Lip-Bu Tan

Intel CEO Lip-Bu Tan lays out a turnaround centered on culture, faster decisions, and balance-sheet repair, while arguing that AI is making CPUs, advanced packaging, and full-stack systems more important. He also frames semiconductor investing as bottleneck hunting and says the industry’s capital intensity increasingly requires government, sovereign, and hyperscale backing.